As semiconductor patterning continues to scale, even small layout nonuniformities can lead to noticeably different process outcomes. Real chip layouts contain a mix of dense regions, large open ...
Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results